Inspection de circuit imprimé à base des couleurs

Color-based inspection of printed circuit boards

Farbbasierte Inspektion von gedruckten Leiterplatten

Abstract

In generating inspection logic of a new component, the image of a new component is obtained, the trend data for selected characteristics of the focused region of said new component is computed; a previously inspected component having characteristics similar to that of said new component is selected by comparing the trend data of said new component with trend data of said previously inspected component, the image of the selected (previously inspected) component is read from the storage device (32), and inspection logic for said new component is generated using the images of said new component and images of said selected component as teaching data.

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Patent Citations (1)

    Publication numberPublication dateAssigneeTitle
    EP-1388738-A1February 11, 2004Omron CorporationVerfahren zur Produktion von Inspektionsdaten und Inspektionsgerät für Leiterplatten zur Durchführung des Verfahrens

NO-Patent Citations (2)

    Title
    JONG-SEOK PARK, JULIUS T. TOU: "A solder joint inspection system for automated printed circuitboard manufacturing", PROCEEDINGS IEEE INTERNATIONAL CONFERENCE ON ROBOTICS AND AUTOMATION, vol. 2, 13 May 1990 (1990-05-13) - 18 May 1990 (1990-05-18), Cincinnati, OH, USA, pages 1290 - 1295, XP002439950, ISBN: 0-8186-9061-5, Retrieved from the Internet [retrieved on 20070628]
    TAKASHI ANEZAKI: "Factory Worker-Oriented Programless Visual Inspection System", IEEE INTERNATIONAL CONFERENCE ON SYSTEMS, MAN AND CYBERNETICS, vol. 2, 8 October 2000 (2000-10-08) - 11 October 2000 (2000-10-11), Nashville, TN, USA, pages 1175 - 1180, XP002439951, ISBN: 0-7803-6583-6, Retrieved from the Internet [retrieved on 20070628]

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